Battery Charger ICs from Summit Microelectronics
Summit Microelectronics has introduced two more members of its third-generation programmable battery charger integrated circuit (IC) family.
The SMB136 and SMB137B employ Current Path technology, providing dual input source (USB or AC/DC) with arbitration, dual output for system and battery and system operation with a dead or missing battery.
Both products support all battery charging standards:
- USB 2.0 Specification,
- USB On-The-Go Supplement,
- USB Battery Charging Specification 1.0,
- IEEE1725 Standard,
- Chinese USB Charging Specification, and others.
Furthermore, the SMB136 and SMB137B are the only battery charger ICs with CurrentPath to detect the input source type (USB host/hub, AC/DC, etc.).
For more information please contact us.
WIMA New Super Cap Modules

Double-Layer Capacitors from WIMA are now also available as cascaded and balanced modules with capacitances up to 200 F or with nominal voltages up to 28 VDC.
WIMA SuperCaps have a service life beyond 10 years and can easily sustain more than 500,000 charge/discharge cycles, when operated within specification.
The efficiency is far higher than 90%. Compared to other energy storage solutions, WIMA SuperCaps stand out for maintenance-free operation, high life expectancy and relatively low weight. This makes them very well suited to applications in isolated systems e.g. in inaccessible areas.
For more information please contact us.
IEE Announces Display Bonding and Lamination Capabilities
Dupont Vertak Bonding Process
- Proven High Performance Gen2 Adhesive Technology
- Re-workable Process
Direct Bonding of LCDs from 1.5” to 24” Active Display Area.
Frame Options
- In-Frame Bonding
- On-Frame Bonding
- Over-Frame Bonding
Why Direct Bonding by IEE Works?
For more information please contact us.