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Platform Manager From Lattice Transforms Board Power & Digital Management
Programmable Devices Reduce Cost Up to 50%; Cut Weeks From Design Time; Monitor Power Supplies with 0.7% Accuracy
Lattice Semiconductor Corporation (NASDAQ: LSCC) has announced its third-generation mixed-signal devices, the Platform Managerâ„¢ family. The programmable Platform Manager devices are expected to simplify board management design significantly by integrating programmable analog and logic to support many common functions, such as power management, digital housekeeping and glue logic. By integrating these support functions, Platform Manager devices can not only reduce the cost of these functions compared to traditional approaches, but also can improve system reliability and provide a high degree of design flexibility that minimizes the risk of circuit board re-spins.
About the Platform Manager Family
The Platform Manager product family consists of two devices, the LPTM10-1247 and LPTM10-12107. The LPTM10-1247 device can monitor 12 voltage rails and supports 47 digital I/O, while the LPTM10-12107 monitors up to 12 voltage rails and supports 107 digital I/O. Functionally, these devices include both a power management section and a digital board management section. The power management section consists of a programmable threshold, precision differential input comparator block with an accuracy of 0.7%, a 48-macrocell CPLD, programmable hardware timers, a10-bit analog to digital converter and a trim block for the trimming and margining of supplies. The digital board management section consists of a 640-LUT FPGA and programmable logic interface I/O.
For more details on the very popular Platform Manager devices from Lattice, please contact us.
MICREL Cuts Power Requirement For Ethernet Connectivity in Half
Micrel Inc., an industry leader in analog, high bandwidth communications and Ethernet IC solutions, has released the KSZ8051/8031 family of ultra low-power, small package single-port 10/100 Physical Layer Transceivers. These devices provide the MII or RMII interface to transmit and receive data over standard CAT-5 unshielded twisted pair (UTP) cable or fiber. The solution is based on Micrel’s enhanced mixed-signal design which enables power consumption to be reduced by half compared to the prior generation. The devices feature high integration (on-chip termination and integrated regulator), reduced system cost and simplified system design. The ICs also feature higher performance and an extended feature set all in very compact package options.
Full compliance to the IEEE 802.3/802.3u standard ensures that the devices will work seamlessly with other standards compliant, already deployed devices. The ultra low power design satisfies the green requirement in today’s consumer, industrial and automotive Ethernet applications. On-chip termination not only eliminates components, simplifies PCB design and reduces system BOM, but also improves overall signal integrity and EMI emissions. The single external power supply (3.3V), with integrated regulator, enables core operation at 1.2V with IO at 1.8V/2.5V/3.3V. The KSZ8051MLL/FLL comes in a 48-pin LQFP package and provides a MII MAC interface with the option to interface to copper or fiber media. The KSZ8051MNL/RNL is a copper transceiver housed in a 32-pin QFN with the option for a MII or RMII MAC interface. The KSZ8031RNL offers the smallest package, 24-pin QFN, with an RMII MAC interface. Auto MDI/MDIX crossover support eliminates the need for a cross-over cable, thus reducing installation costs. Easy to use, the LinkMD(R) TDR-based cable diagnostics allow for identification of common cabling problems, including those not addressed by IEEE standards. This simplifies network deployment and reduces network downtime.
The low emissions and Micrel’s signature high reliability and quality also make these devices suitable for connectivity applications in the fast growing industrial automation and automotive markets.
For more details on these new PHY Layer Transcievers from Micrel, please contact us.
ISSI ANNOUNCES 64Mb and 32Mb Pseudo SRAMs (PSRAMs) TARGETED FOR WIRELESS, INDUSTRIAL, EMBEDDED, and AUTOMOTIVE APPLICATIONS
Integrated Silicon Solution, Inc., a leader in advanced memory solutions, has added 64Mb and 32Mb density devices to their line of Pseudo SRAMs. These new devices add to the previously released 4Mb and 8Mb parts, and give the design engineer a wide range of densities from which to choose to best fit the application’s requirements. These PSRAMs are designed to provide the characteristics and ease of use of an SRAM, but with the improved density and cost reduction associated with using a DRAM.
The 64Mb is organized as 4Mx16 and the 32Mb is 2Mx16. The IS66WVE2M16ALL/BLL and the IS66WVE4M16ALL/BLL are the 1.8V and 3.3V options of the asynchronous solution for this product family. The IS66WVC2M16ALL, IS66WVD2M16ALL, IS66WVC4M16ALL and the IS66WVD4M16ALL are the CRAM 1.5 and CRAM 2.0 options of this product family. As such, this product line provides the designer with a variety of high density, cost effective, low power memory solutions.
In these products, refresh of the DRAM cells is handled internally, eliminating the need for an external refresh controller. Partial Array Refresh (PAR), low standby current and Deep Power Down (DPD) modes of these products makes it ideal for low power applications. The CRAM 1.5 option adds the synchronous / burst interface mode, an on-die temperature sensor for temperature compensated refresh (TCR), fixed latency, and drive strength control for the outputs. In addition to the CRAM 1.5 feature set, CRAM 2.0 adds a multiplexed address and data bus for reduced pin count.
This cost effective, low power, high density memory combined with extended temperature, and options that include the Know Good Die (KGD) format make the product line perfect for wireless, industrial, embedded, and automotive applications.
For more details on these new Pseudo SRAMS from ISSI, please contact us.