LOGIC Devices, a developer of high performance, low power integrated circuits; has announced plans to start sampling its' DDR3 IMOD products in Q2'09. LOGIC Devices first DDR3 device is a 4.0 GB, 64 M x 64, DDR3-1333 DRAM available in Industrial (-40C to +85C), Extended (-40C to +105C) and Mil temperature (-55C to +125C) grades, and packaged in a 16mm x 22mm, thermally enhanced, 271ball -1.00mm pitch, PBGA. These devices provide a 40% space savings over the use of (4) 96 ball, 9.00+mm x 16.00+mm BGAs as well as a 30% decrease in total I/O, all while providing major improvements in heat dissipation via use of proprietary packaging IP.