LATTICE MachXO2 PLD FAMILY SETS NEW STANDARDS FOR LOW COST, LOW POWER DESIGNS

Lattice Semiconductor Corporation (NASDAQ: LSCC) has unveiled its new MachXO2^TM PLD family, which offers designers of low-density PLDs an unprecedented mix of low cost, low power and high system integration in a single device. Built on a low power 65-nm process featuring embedded Flash technology, theMachXO2 family delivers a 3X increase in logic density, a 10X increase in embedded memory, more than a 100X reduction in static power and up to 30% lower cost compared to the MachXO^TM PLD family.  In addition, several popular functions used in low-density PLD applications, such as User Flash Memory (UFM), I2C, SPI and timer/counter, have been hardened into the MachXO2 devices, providing designers a "Do-it-All-PLD" for high volume, cost sensitive designs.

"Through the use of 65-nm embedded Flash technology, we have reduced costs and increased functionality for our traditional customers in the computing, industrial and telecommunication infrastructure markets, while dramatically reducing power consumption for designers of consumer equipment," said Gordon Hands, Director of Marketing for Low Density and Mixed Signal Solutions. "Many early access customers are already evaluating and designing with MachXO2 devices in a broad range of applications."

MachXO2 Block Diagram

Three Product Options For Maximum Flexibility

The MachXO2 family offers three options for maximum flexibility. MachXO2 ZE devices range from 256 to 7K look-up tables (LUTs), operate off a nominal 1.2V power supply, and support system performance up to 60MHz. With power specified as low as 19uW and packages as small as 2.5mmx2.5mm, the MachXO2 ZE devices are optimized for cost-sensitive, low power consumer design applications such as smart phones, GPS devices and PDAs.



MachXO2 HC devices range from 256 to 7K LUTs, operate off a nominal 3.3V or 2.5V power supply, and support system performance up to 150MHz. Offering up to 335 user I/O and a robust design solution (instant-on, non-volatile, input hysteresis and single-chip), these devices are ideal for control applications in end markets such as telecommunications infrastructure, computing, industrial and medical equipment.

MachXO2 HE devices range from 2K to 7K LUTs, operate off a nominal 1.2V power supply and support system performance up to 150MHz. These devices are optimized for power sensitive system applications.

Free Design Tools and Free Reference Designs Accelerate Development Time

Customers can start designing with MachXO2 devices today using Lattice Diamond^TM v1.1 software, which can be downloaded for free from the Lattice website at

http://www.latticesemi.com/latticediamond/downloads/

Existing ispLEVER^R software users have the option to use the free ispLEVER v8.1 SP1 Starter software, downloadable from the Lattice web site, with an installed control pack. Visit http://www.latticesemi.com/starter.

In order to enable quick and efficient design and deployment of commonly used functions in system and consumer applications, more than 20 reference designs using MachXO2 devices can be downloaded for free from the Lattice website at http://www.latticesemi.com/referencedesigns.

For more information, including pricing or availability on devices from the new MachXO2^TM PLD family, please contact us.

ZamLock Pro Secure Flash Drive for rugged Industrial and Military Applications

ZamLock Pro the only secure memory storage device that balances security, usability and cost.

• 10-key PIN-pad
• Multiple density options, up to 16GB

Physical Protection Highlights

• The strengthened anodised aluminium shell is filled with an epoxy potting, providing a damage resistant barrier
• Designed to meet IP57 rating
  for dust resistance and waterproof
  up to 1 meter immersion

Data Protection Highlights 

• Authentication performed on drive, not computer, makes drive immune to keyboard loggers
• PIN-pad protection makes drive impervious to computer/Internet based hacking attempts since drive is not mounted until correct PIN is entered
• Full-disk encryption with on-the-fly 256-bit AES hardware encryption
• 10 incorrect PIN attempts deletes both the PIN and encryption key, requiring reformat of the drive (drive recoverable, not data)

Usability Highlights

• Truly platform independent. Use with and across any Operating System with no updates ever required
• Compatible with any software application (3rd party port management software, virtual desktop, portable applications, etc.) and bootable
• Dual-PIN capable (administrator & user)

While maintaining the unparallel hardware authentication and encryption standard in all Zamlock drives, the ruggedised Zamlock Pro is designed with the mobile workforce in mind.

Additional physical features make the 10-key Zamlock Pro the go-to storage memory drive for users where data security is critical.




For more details or pricing regarding ZamLock Secure Flash Drives, please contact us.

ISSI adds 256Mb DDR2 SDRAM to portfolio, targeted for Automotive, Networking, Telecom, and Industrial Applications

Integrated Silicon Solution, Inc. (Nasdaq: ISSI), a leader in advanced memory solutions, has added the 256Mb density to their family of DDR2 SDRAMs. This addition expands ISSI's DDR2 SDRAM family to include densities of 256Mb, 512Mb and 1Gb. This expansion of the DDR2 SDRAM product family adds to ISSI's already extensive offering of SDR, DDR and DDR2 SDRAMs.

The 256Mb density is offered as 8Mx32, 16Mx16 and 32Mx8, in BGA packages with speeds up to 400Mhz (DDR2-800), giving design engineers a lower density option when a 512Mb device is not required. These devices operate from a single supply voltage of 1.8V

DDR2 SDRAMs are used in a variety of applications including automotive telematics and infotainment, networking/telecom access nodes, VoIP, switches, routers, and packet optical transport, plus many industrial applications. These applications typically require long term production support, which ISSI specialise in.
Samples and volume production support for the 8Mx32, IS43DR32800A (Standard Page Size) and the IS43DR32801A (Reduced Page Size) are available now.

Samples of the 16Mx16, IS43DR16160A and 32Mx8, IS43DR83200B are available now with volume production support beginning in Q1 2011. Samples of automotive versions of the 8Mx32, IS46DR32801A and the 16Mx16, IS46DR16160A are also available now.

For more details or pricing regarding these 256M DDR2 SDRAM, or any other memory solutions from ISSI, please contact us.

NEW "PLATFORM MANAGER" FROM LATTICE TRANSFORMS BOARD POWER AND DIGITAL MANAGEMENT

Programmable Devices Reduce Cost Up to 50%; Cut Weeks From Design Time; Monitor Power Supplies with 0.7% Accuracy

Lattice Semiconductor Corporation (NASDAQ: LSCC) has announced its third-generation mixed-signal devices, the Platform Manager™ family. The programmable Platform Manager devices are expected to simplify board management design significantly by integrating programmable analog and logic to support many common functions, such as power management, digital housekeeping and glue logic. By integrating these support functions, Platform Manager devices can not only reduce the cost of these functions compared to traditional approaches, but also can improve system reliability and provide a high degree of design flexibility that minimizes the risk of circuit board re-spins.

About the Platform Manager Family

The Platform Manager product family consists of two devices, the LPTM10-1247 and LPTM10-12107. The LPTM10-1247 device can monitor 12 voltage rails and supports 47 digital I/O, while the LPTM10-12107 monitors up to 12 voltage rails and supports 107 digital I/O. Functionally, these devices include both a power management section and a digital board management section. The power management section consists of a programmable threshold, precision differential input comparator block with an accuracy of 0.7%, a 48-macrocell CPLD, programmable hardware timers, a10-bit analog to digital converter and a trim block for the trimming and margining of supplies. The digital board management section consists of a 640-LUT FPGA and programmable logic interface I/O.

For more details on the very popular Platform Manager devices from Lattice, please contact us.

MICREL CUTS POWER REQUIREMENT FOR ETHERNET CONNECTIVITY IN HALF

Micrel Inc., an industry leader in analog, high bandwidth communications and Ethernet IC solutions, has released the KSZ8051/8031 family of ultra low-power, small package single-port 10/100 Physical Layer Transceivers. These devices provide the MII or RMII interface to transmit and receive data over standard CAT-5 unshielded twisted pair (UTP) cable or fiber. The solution is based on Micrel's enhanced mixed-signal design which enables power consumption to be reduced by half compared to the prior generation. The devices feature high integration (on-chip termination and integrated regulator), reduced system cost and simplified system design. The ICs also feature higher performance and an extended feature set all in very compact package options.

Full compliance to the IEEE 802.3/802.3u standard ensures that the devices will work seamlessly with other standards compliant, already deployed devices. The ultra low power design satisfies the green requirement in today's consumer, industrial and automotive Ethernet applications. On-chip termination not only eliminates components, simplifies PCB design and reduces system BOM, but also improves overall signal integrity and EMI emissions. The single external power supply (3.3V), with integrated regulator, enables core operation at 1.2V with IO at 1.8V/2.5V/3.3V. The KSZ8051MLL/FLL comes in a 48-pin LQFP package and provides a MII MAC interface with the option to interface to copper or fiber media. The KSZ8051MNL/RNL is a copper transceiver housed in a 32-pin QFN with the option for a MII or RMII MAC interface. The KSZ8031RNL offers the smallest package, 24-pin QFN, with an RMII MAC interface. Auto MDI/MDIX crossover support eliminates the need for a cross-over cable, thus reducing installation costs. Easy to use, the LinkMD(R) TDR-based cable diagnostics allow for identification of common cabling problems, including those not addressed by IEEE standards. This simplifies network deployment and reduces network downtime.

The low emissions and Micrel's signature high reliability and quality also make these devices suitable for connectivity applications in the fast growing industrial automation and automotive markets.



For more details on these new PHY Layer Transcievers from Micrel, please contact us.

ISSI ANNOUNCES 64Mb and 32Mb Pseudo SRAMs (PSRAMs) TARGETED FOR WIRELESS, INDUSTRIAL, EMBEDDED, and AUTOMOTIVE APPLICATIONS

Integrated Silicon Solution, Inc., a leader in advanced memory solutions, has added 64Mb and 32Mb density devices to their line of Pseudo SRAMs. These new devices add to the previously released 4Mb and 8Mb parts, and give the design engineer a wide range of densities from which to choose to best fit the application's requirements. These PSRAMs are designed to provide the characteristics and ease of use of an SRAM, but with the improved density and cost reduction associated with using a DRAM.

The 64Mb is organized as 4Mx16 and the 32Mb is 2Mx16. The IS66WVE2M16ALL/BLL and the IS66WVE4M16ALL/BLL are the 1.8V and 3.3V options of the asynchronous solution for this product family. The IS66WVC2M16ALL, IS66WVD2M16ALL, IS66WVC4M16ALL and the IS66WVD4M16ALL are the CRAM 1.5 and CRAM 2.0 options of this product family. As such, this product line provides the designer with a variety of high density, cost effective, low power memory solutions.

In these products, refresh of the DRAM cells is handled internally, eliminating the need for an external refresh controller. Partial Array Refresh (PAR), low standby current and Deep Power Down (DPD) modes of these products makes it ideal for low power applications. The CRAM 1.5 option adds the synchronous / burst interface mode, an on-die temperature sensor for temperature compensated refresh (TCR), fixed latency, and drive strength control for the outputs. In addition to the CRAM 1.5 feature set, CRAM 2.0 adds a multiplexed address and data bus for reduced pin count.

This cost effective, low power, high density memory combined with extended temperature, and options that include the Know Good Die (KGD) format make the product line perfect for wireless, industrial, embedded, and automotive applications.

For more details on these new Pseudo SRAMS from ISSI, please contact us.