Specialist Supplier Of Electronic Components, Semiconductors & Rugged Electronic Systems.

Allyanz Electronics, Semiconductors, Integrated Modules, Displays. Manufacturers Representative & Distributor Australia, NZ & South East Asia. Tel: +61.3.9759 5949

ISSI Now Offering UFS 2.1/2.2 - Universal Flash Storage

ISSI is currently sampling 64 GB, 128 GB & 256 GB devices, supporting UFS 2.1, and UFS 2.2. ISSI’s UFS product family provides the ideal embedded storage solution for the Automotive, Industrial, Medical, Networking, and Consumer applications, which require high performance, endurance, and low power across a wide range of operating temperatures, with long-term support.

ISSI is currently sampling 64 GB, 128 GB & 256 GB devices, supporting UFS 2.1, and UFS 2.2. ISSI’s UFS product family provides the ideal embedded storage solution for the Automotive, Industrial, Medical, Networking, and Consumer applications, which require high performance, endurance, and low power across a wide range of operating temperatures, with long-term support.

ISSI is currently sampling 64 GB, 128 GB & 256 GB devices, supporting UFS 2.1, and UFS 2.2. ISSI’s UFS product family provides the ideal embedded storage solution for the Automotive, Industrial, Medical, Networking, and Consumer applications, which require high performance, endurance, and low power across a wide range of operating temperatures, with long-term support.

LVDS Serial Interface
ISSI Now Offering UFS 2.1/2.2 - Universal Flash Storage
ISSI sampling AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Applications

ISSI’s SLC NAND Flash devices support a wide operating temperature range of -40C to 105C, making them ideal for next generation automotive, industrial and Internet of Things (IoT) applications. Both the SPI NAND and parallel NAND Flash devices are AEC-Q100 qualified meeting the stringent automotive qualification requirements. ISSI offers parallel SLC NAND in 1Gb, 2Gb, 4Gb & 8Gb densities.

ISSI’s SLC NAND Flash devices support a wide operating temperature range of -40C to 105C, making them ideal for next generation automotive, industrial and Internet of Things (IoT) applications. Both the SPI NAND and parallel NAND Flash devices are AEC-Q100 qualified meeting the stringent automotive qualification requirements. ISSI offers parallel SLC NAND in 1Gb, 2Gb, 4Gb & 8Gb densities.

ISSI’s SLC NAND Flash devices support a wide operating temperature range of -40C to 105C, making them ideal for next generation automotive, industrial and Internet of Things (IoT) applications. Both the SPI NAND and parallel NAND Flash devices are AEC-Q100 qualified meeting the stringent automotive qualification requirements. ISSI offers parallel SLC NAND in 1Gb, 2Gb, 4Gb & 8Gb densities.

ISSI sampling AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Applications
ISSI sampling AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Applications
Swissbit Presents Industrial eMMC EM-30 - copy

Swissbit, a leading manufacturer of flash memory solutions, presents its latest technology for demanding industrial, medical & automotive markets: eMMC memory, EM-30.

Swissbit, a leading manufacturer of flash memory solutions, presents its latest technology for demanding industrial, medical & automotive markets: eMMC memory, EM-30.

Swissbit, a leading manufacturer of flash memory solutions, presents its latest technology for demanding industrial, medical & automotive markets: eMMC memory, EM-30.

Swissbit’s EM-30 eMMC offers high performance with up to 300 MB/s for reading and 230 MB/s for writing.

Swissbit industrial grade 3D NAND e-MMC 5.1 bga
Swissbit Presents Industrial eMMC EM-30 - copy
ISSI Introduces 512Mb SPI NOR Flash for Automotive & Industrial Markets - copy

Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory and analog solutions, has begun sampling production units of automotive grade 512Mb Serial (SPI) NOR Flash.

Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory and analog solutions, has begun sampling production units of automotive grade 512Mb Serial (SPI) NOR Flash.

issi1 car technoology
ISSI Introduces 512Mb SPI NOR Flash for Automotive & Industrial Markets - copy
IS32LT3175-full-function-linear-led-driver-ic-for-automotive-interior-lighting
ISSI Announces Full Function LED Driver IC For Automotive Interior Lighting

ISSI Full Function LED Driver IC For Automotive Interior Lighting. Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory and analog IC solutions, has announced a single chip solution for automotive interior lighting.

IS32LT3175-full-function-linear-led-driver-ic-for-automotive-interior-lighting
IS32LT3175-full-function-linear-led-driver-ic-for-automotive-interior-lighting
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Achronix Speedcore eFPGAs Offer Unbeatable Bandwidth and Latency Performance

Achronix Speedcore embedded FPGA (eFPGA) IP from Achronix has brought the power and flexibility of programmable logic to ASICs and SoCs.

Achronix Speedcore eFPGA IP

Customers can integrate a Achronix Speedcore eFPGA into an SoC for high-performance, compute-intensive and real-time processing applications such as AI, machine learning, 5G wireless, networking and automotive.

Proven on the TSMC 16FF+ process node, Speedcore eFPGA IP enables customers to create a customized programmable fabric.

Users specify their logic, memory and DSP resource needs, then Achronix configures the Speedcore IP to meet their individual requirements. Speedcore look-up-tables (LUTs), RAM blocks and DSP64 blocks can be assembled like building blocks to create the optimal programmable fabric for any given application. Achronix delivers the customized Speedcore eFPGA instance as a hard macro in GDSII format along with a customized version of ACE design tools.

There are many benefits to embedding Speedcore technology into an SoC. Compared to a separate standalone FPGA, Speedcore eFPGA IP offers the following:

  • 10× higher bandwidth
  • 100× lower latency
  • 10× lower cost
  • 50% lower power

Achronix Speedcore FPGA Compiled Architecture

Achronix Speedcore eFPGA IP

As opposed to a one-size-fits-all approach to building an embeddable FPGA fabric, the Speedcore solution is compiled architecture.

Rather than having to pick from a library of pre-built fabrics, a system architect can define a mix of LUTs, LRAMs, BRAMs and DSP blocks for a cluster, then specify overall resource goals for the fabric along with an aspect ratio (expressed in clusters). The resulting fabric is an X by Y array of these custom clusters.

During this specification phase, Achronix returns a detailed proposal on the custom fabric, plus a software model for evaluation using ACE design tools.

 

Customers can specify the resource counts for their Speedcore instance for the following building blocks:

  • Logic – look-up-tables (LUTs) plus integrated wide MUX functions and fast adders
  • Logic RAM – 4 kb per memory block
  • Block RAM – 20 kb per memory block
  • DSP64 – each block has a 18 × 27 multiplier, 64-bit accumulator and 27-bit pre-adder
  • Custom blocks – customer/application-specific functions

Resource & performance specifications include:

Speedcore logic density – from 5K to 2M LUTs

Speedcore performance – max 750 MHz

Speedcore power – 12 mW static power per 1,000 LUTs at 105°C (on the TSMC 16FF+ process)

Speedcore die size – 0.20 mm2 per 1,000 LUTs (on the TSMC 16FF+ process)

For more information on SpeedCore eFPGAs from Achronix, please contact Allyanz today.

Lattice Extends Video Interface Platform to GigE/USB 3.0

Lattice Video Interface Platform GigE/USB 3.0

Lattice Extends Video Interface Platform to GigE USB 3.0
Need to quickly build embedded vision prototypes with Ethernet connectors running at Gigabit speeds?

Lattice’s latest I/O board for the Video Interface Platform (VIP) does just that. The new I/O board is the latest addition to Lattice’s highly modular platform.

By replacing cumbersome manual wiring with a unified connector, designers can quickly build plug-and-play solutions.

The new GigE/USB 3.0 I/O board allows developers to quickly and easily add network connectivity options to Lattice’s award-winning Embedded Vision Development Kit.

Lattice Video Interface Platform GigE USB 3.0

The kit combines a CrossLink mobile bridging input board, an optimised ECP5 image signal processing board, and high res HDMI VIP Input and Output boards into a ready-to-use platform.

The VIP platform also offers IP from 3rd party partners including commercial grade image signal processing and networking stacks, Helion Vision’s GigE Vision, multiple sensor board inputs, and DisplayPort IP from Bitec.

For more information on the Video Interface Platform from Lattice, please contact Allyanz today.

Programmable Color Sequence RGB LED Driver for IoT applications

Self-running with RGB patterns saves power with no processor interaction.

Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory and analog IC solutions, has introduced the IS31FL3194, latest addition to the company’s innovative line of FxLED RGB drivers.

ISSI Programmable Color Sequence RGB LED Driver For IO Applications

The IS31FL3194 is a fully programmable 3 channel LED driver supporting a wide range of color rendering capabilities for consumer and industrial IoT applications.

The IS31FL3194 can be programmed through a 400 kHz I2C bus to perform LED light timing sequences and color patterns with gamma correction.

Each of the 3 LED channels can be independently adjusted to 8-bit current levels (40mA max), 8-bit PWM (RGB color mixing), gamma correction, and timing sequences.

These wide range of programmable sequences will continue operating even when the system microcontroller is in standby mode thereby conserving system power.

“As a leading provider of innovative LED driver solutions for the consumer and automotive markets we recognize one of the challenges faced by our customers has been lowering the system power budget,” said Ven Shan, VP of Analog Marketing at ISSI. “We developed the IS31FL3194 with programmable RGB pattern sequences so it can continue driving the LEDs even when the micro is placed in a low power sleep mode. Because the IS31FL3194 takes responsibility of driving the LEDs, this not only saves system power but also frees up the micro to focus on system critical functions.”

The IS31FL3194 is available in a tiny 1mmx1.6mm WCSP-8 package, making it one of the smallest and most highly programmable LED driver solutions in the market today.

The flexible programmability enables one to configure the RGB LEDs to operate either as one RGB group or RG+W group or 3 single color LED in a pre-established pattern.

In addition a low 150mV dropout voltage at 20mA, 0.8mA quiescent current and a 1uA shutdown current makes this an ideal solution for low-power battery applications.

The IS31FL3194 LED Driver can generate pre-programmed colors with patterns that can be used as signals to gain attention or to provide notification or status in wearables, portable medical devices, smart home, smart retail and other emerging IoT applications.

For more information on this new RGB LED driver, samples or evaluation boards, please contact Allyanz today.

Swissbit introduces USB 3.1 sticks

Swissbit is pleased to introduce a new range of USB 3.1 flash drives. The new USB sticks fulfill the tough requirements of flash memory for industrial use.

Mobile, designed for industrial use and secure.

Swiss U500K USB Stick

 

The series is based on a highly sophisticated USB 3.1 flash controller and comprises the product range U-500k with a highly reliable SLC-NAND and U-50k with MLC-NAND. Furthermore, a version with MLC-NAND in pSLC configuration is offered under the name U-56k.

The benefit: an endurance seven times longer than that of a MLC-NAND with the same memory density.

Swissbit plans to have the following densities available by the third quarter of 2018:

– SLC versions, 2GB to 32 GB,

– MLC version, 16GB to 128 GB

– pSLC version, 8GB to 64 GB

Particularly important considering the new stricter data protection provisions: all USB 3.1 sticks are also offered in versions with integrated data protection features.

USB flash drives are often used to transport data between different locations or as exchangeable memory expansion in industrial applications such as log data storage, data backup, system upgrade or as license token. Now Swissbit offers new USB stick ranges that fulfill the same requirements for professional applications as other industrial storage solutions yet are extremely easy to use and universally applicable.

Firmware for smart memory chip usage

In combination with the SuperSpeed USB 3.1 interface, U-500k, U-50k and U 56k offer outstanding data rates for the sequential writing of data. As the firmware works with page-based mapping, the random-write IOPS performance increases, while wear decreases significantly. This in turn makes USB sticks the perfect solution for data logging applications. Smart firmware routines recognize weak data segments and update them before any data loss occurs. This is particularly important when used as boot medium or for long-term data storage.

Security and data protection

Swissbit will offer special variants of these USB sticks for confidential or license-relevant content under the names PU-500k, PU-50k and PU-56k. Configurable security options allow for data encryption and access restrictions with PIN protection including repeat counter and hidden or read-only partitions. The data protection option “DP” prevents data from being spied upon in case of loss or theft of a flash drive. Furthermore, the secured USB stick can also be employed as copy-protected license tokens.

Proven enclosure

For this new USB 3.1 product range, Swissbit AG once again has opted for their proven flash drive casing “unitedCONTRAST II”, already used for the very popular USB 2.0 sticks.

All new USB sticks are also available in custom design options.

Additionally, Swissbit plans to also add a “Nano” form factor to this range – a robust flash drive in an enclosed tamper-proof metal casing.

For more information on Swissbit USB 3.1 sticks, samples or evaluation, please contact Allyanz today.

Ultra-Low Power Lattice sensAI Leads Mass Market Enablement of Artificial Intelligence in Edge Devices

New FPGA Solutions Open Doors for Rapid Deployment of Machine Learning Inferencing Across Broad Market IoT Applications Demanding Milliwatt Range Power Consumption

Ultra-Low Power Lattice sensAI

  • Accelerates deployment of AI into fast growth consumer and industrial IoT applications including mobile, smart home, smart city, smart factory, and smart car products
  • Optimized to provide ultra-low power (under 1 mW–1 W), small size, and production-priced (~$1-$10 USD) benefits of ASICs, with FPGA flexibility to support evolving algorithms, interfaces, and tailored performance
  • Full-featured Lattice sensAI stack offers modular hardware platforms, neural network IP cores, software tools, reference designs, and custom solutions via partner eco-system

Lattice Semiconductor Corporation (NASDAQ: LSCC) has unveiled Lattice sensAI – a complete technology stack combining modular hardware kits, neural network IP cores, software tools, reference designs and custom design services – to accelerate integration of machine learning inferencing into broad market IoT applications.

With solutions optimized for ultra-low power consumption (under 1 mW–1 W), small package size (5.5 mm2 –100 mm2), interface flexibility (MIPI® CSI-2, LVDS, GigE, etc.), and high-volume pricing (~$1-$10 USD), Lattice sensAI stack fast-tracks implementation of edge computing close to the source of data.

Ultra-Low Power Lattice sensAI Chart

“Lattice sensAI addresses the unmet need for flexible, low cost, ultra-low power AI silicon solutions suited for rapid deployment across a wide range of emerging, mass market IoT applications,” said Deepak Boppana, senior director, product and segment marketing at Lattice Semiconductor.

“By delivering a full-featured machine learning inferencing technology stack combining flexible, ultra-low power FPGA hardware and software solutions, the Lattice sensAI stack accelerates integration of on-device sensor data processing and analytics in edge devices. These new edge computing solutions build on our leadership in FPGAs for edge connectivity, implementing flexible sensor interface bridging and data aggregation in high-volume IoT applications, including smart speakers, surveillance cameras, industrial robots and drones.”

To address the computing opportunities at the Edge, Lattice’s sensAI stack includes the following:

  • Modular Hardware Platforms – ECP5 device-based Video Interface Platform (VIP), including the award-winning Embedded Vision Development Kit, and iCE40 UltraPlusdevice-based Mobile Development Platform (MDP).
  • IP Cores – Convolutional Neural Network (CNN) accelerator and Binarized Neural Network (BNN) accelerator.
  • Software Tools – Neural network compiler tool for Caffe/TensorFlow to FPGA, Lattice Radiant design software, Lattice Diamond® design software.
  • Reference Designs – Face detection, key phrase detection, object counting, face tracking, and speed sign detection.
  • Design Services – Eco-system of design service partners delivers custom solutions for broad market applications, including smart home, smart city, and smart factory.

Please contact Allyanz today for further details on Lattice sensAI, including samples & evaluation boards.

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