Specialist Supplier Of Electronic Components, Semiconductors & Rugged Electronic Systems.

Allyanz Electronics, Semiconductors, Integrated Modules, Displays. Manufacturers Representative & Distributor Australia, NZ & South East Asia. Tel: +61.3.9759 5949

ISSI Now Offering UFS 2.1/2.2 - Universal Flash Storage

ISSI is currently sampling 64 GB, 128 GB & 256 GB devices, supporting UFS 2.1, and UFS 2.2. ISSI’s UFS product family provides the ideal embedded storage solution for the Automotive, Industrial, Medical, Networking, and Consumer applications, which require high performance, endurance, and low power across a wide range of operating temperatures, with long-term support.

ISSI is currently sampling 64 GB, 128 GB & 256 GB devices, supporting UFS 2.1, and UFS 2.2. ISSI’s UFS product family provides the ideal embedded storage solution for the Automotive, Industrial, Medical, Networking, and Consumer applications, which require high performance, endurance, and low power across a wide range of operating temperatures, with long-term support.

ISSI is currently sampling 64 GB, 128 GB & 256 GB devices, supporting UFS 2.1, and UFS 2.2. ISSI’s UFS product family provides the ideal embedded storage solution for the Automotive, Industrial, Medical, Networking, and Consumer applications, which require high performance, endurance, and low power across a wide range of operating temperatures, with long-term support.

LVDS Serial Interface
ISSI Now Offering UFS 2.1/2.2 - Universal Flash Storage
ISSI sampling AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Applications

ISSI’s SLC NAND Flash devices support a wide operating temperature range of -40C to 105C, making them ideal for next generation automotive, industrial and Internet of Things (IoT) applications. Both the SPI NAND and parallel NAND Flash devices are AEC-Q100 qualified meeting the stringent automotive qualification requirements. ISSI offers parallel SLC NAND in 1Gb, 2Gb, 4Gb & 8Gb densities.

ISSI’s SLC NAND Flash devices support a wide operating temperature range of -40C to 105C, making them ideal for next generation automotive, industrial and Internet of Things (IoT) applications. Both the SPI NAND and parallel NAND Flash devices are AEC-Q100 qualified meeting the stringent automotive qualification requirements. ISSI offers parallel SLC NAND in 1Gb, 2Gb, 4Gb & 8Gb densities.

ISSI’s SLC NAND Flash devices support a wide operating temperature range of -40C to 105C, making them ideal for next generation automotive, industrial and Internet of Things (IoT) applications. Both the SPI NAND and parallel NAND Flash devices are AEC-Q100 qualified meeting the stringent automotive qualification requirements. ISSI offers parallel SLC NAND in 1Gb, 2Gb, 4Gb & 8Gb densities.

ISSI sampling AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Applications
ISSI sampling AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Applications
Swissbit Presents Industrial eMMC EM-30 - copy

Swissbit, a leading manufacturer of flash memory solutions, presents its latest technology for demanding industrial, medical & automotive markets: eMMC memory, EM-30.

Swissbit, a leading manufacturer of flash memory solutions, presents its latest technology for demanding industrial, medical & automotive markets: eMMC memory, EM-30.

Swissbit, a leading manufacturer of flash memory solutions, presents its latest technology for demanding industrial, medical & automotive markets: eMMC memory, EM-30.

Swissbit’s EM-30 eMMC offers high performance with up to 300 MB/s for reading and 230 MB/s for writing.

Swissbit industrial grade 3D NAND e-MMC 5.1 bga
Swissbit Presents Industrial eMMC EM-30 - copy
ISSI Introduces 512Mb SPI NOR Flash for Automotive & Industrial Markets - copy

Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory and analog solutions, has begun sampling production units of automotive grade 512Mb Serial (SPI) NOR Flash.

Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory and analog solutions, has begun sampling production units of automotive grade 512Mb Serial (SPI) NOR Flash.

issi1 car technoology
ISSI Introduces 512Mb SPI NOR Flash for Automotive & Industrial Markets - copy
IS32LT3175-full-function-linear-led-driver-ic-for-automotive-interior-lighting
ISSI Announces Full Function LED Driver IC For Automotive Interior Lighting

ISSI Full Function LED Driver IC For Automotive Interior Lighting. Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory and analog IC solutions, has announced a single chip solution for automotive interior lighting.

IS32LT3175-full-function-linear-led-driver-ic-for-automotive-interior-lighting
IS32LT3175-full-function-linear-led-driver-ic-for-automotive-interior-lighting
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ISSI Now Sampling the Read-While-Write (RWW) Octal Flash

ISSI offers a complete portfolio of Octal Memory that supports high-speed, low pin count devices utilizing the JEDEC xSPI interface.

The Octal (xSPI) interface enhances system performance, simplifies design, and reduces system cost.

ISSI’s new family of Octal products include: Octal (xSPI) FlashOctal RAM, and Octal MCP solutions. Octal (xSPI) Flash memory delivers the performance needed for embedded systems that require fast, instant boot times.

ISSI’s Octal Flash delivers 400 MB/s of read bandwidth, which is over 4x times faster than a Quad SPI Flash. The Read While Write (RWW) feature further enhances the Octal (xSPI) family by allowing these devices to be read, while being programmed. Applications such as OTA (Over The Air) update require RWW functionality.

256Mb/512Mb RWW samples are available now. 64Mb RWW samples are expected to be available May-June 2024.

For more details or if you would like samples for your design, please contact Allyanz.

Lumissil offers Automotive MCU with integrated LINK PHY

Lumissil is pleased to introduce its new automotive grade microcontrollers Lumissil with integrated LIN Phy.

Lumissil Automotive MCU with integrated LINK PHY
The CS89xx series of MCU’s are ideally suited to modern vehicles that require 8-bit MCUs for simple tasks such as basic buttons, simple sensor interfacing and motor control.

For more details or if you would like samples for your design, please contact Allyanz.

High Reliability 500W DC/DC Power Modules from Gaia offer Superior Thermal Performance

The MGDS-500 Series features a full range of high density, wide input range DC/DC power modules designed for aerospace, military and high-end industrial applications.

High Reliability 500W DC/DC Power Modules from GaiaWith 500W output power, the MGDM-500 Series is particularly suitable for ultra compact power supply design.

Standard power modules are available with wide input voltage ranges of 9-36Vdc and 16-80Vdc, and provide output voltages of 12, 15, 24, 28, and 48VDC.

The MGDM Series utilizes a patented fixed switching topology, providing broad input range, low noise characteristics and high power density.

Synchronization function allows more than one converter to operate with an external source frequency.

All power modules incorporate LC network filters to minimize reflected input current ripple and output voltage ripple.

The modules have totally independent functions including input under voltage lock-out, output overvoltage protection, output current limitation protection, and temperature protection.

Additionally, a soft-start function allows current limitation and eliminates inrush current during start-up.

Key Features include:

  • Standard half brick package
  • Single output
  • Operating efficiencies up to 91%
  • Soft start
  • No load to full load operation
  • No optocoupler for high reliability
  • Nominal power up to 500W
  • Galvanic isolation 1500 VDC
  • Switching frequency 300 KHz
  • Protections : Input undervoltage lockout, Output current limitation, Output overvoltage, Over temperature
  • Trim adjustment : 90% to 110%
  • External synchronization range : 270 to 330 KHz
  • On/Off, Sense functions

For more details or if you would like samples for your design, please contact Allyanz.

Lattice Introduces Industry’s First Small Embedded Vision FPGA with Integrated USB

Extends small, low-power FPGA portfolio with first-in-class FPGA featuring hardened USB for AI & embedded vision applications

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, introduces the Lattice CrossLinkU™-NX FPGA family, the industry’s first FPGAs with integrated USB device functionality in their class.

Lattice Embedded Vision FPGA with Integrated USB

CrossLinkU-NX FPGAs help accelerate USB-equipped system designs and simplify thermal management through a combination of a hardened USB controller and physical layer (PHY), a unique low power standby mode, and a complete set of reference designs.

Extending Lattice’s embedded vision sensor bridging leadership with USB host interfaces, CrossLinkU-NX FPGAs are designed to meet growing customer needs to simplify USB-based design for applications across the Computing, Industrial, Automotive, and Consumer markets.

“Reducing power consumption, total cost of ownership, and design footprint are critical for expanding the potential of AI and vision applications,” said Dan Mansur, Vice President, Product Marketing, Lattice Semiconductor. “Lattice CrossLinkU-NX FPGAs are optimized to address these demands by integrating our low power, small form factor leadership with the popular USB connectivity interface to help designers extend battery life and simplify system design.”

 

Built on the award-winning Lattice Nexus™ platform, key features and performance highlights of the new low power Lattice CrossLinkU-NX FPGAs include:
* Vision Processing FPGAs with USB

  • Featuring hardened USB 2.0 up to 480 Mbps and USB 3.2 up to 5 Gbps
  • Reducing total cost of ownership and area needed for discrete PHY components
  • Reducing FPGA fabric resources required for USB device controller

* Low Power Standby Mode with Always-On (AON)

  • Extending battery life and simplifying system thermal management
  • Optimizing power consumption in a typical embedded vision application

* Complete Set of Reference Designs

  • Offering a Lattice Propel™ template, host driver, and example host utilities for USB to I/O bridging and MIPI CSI-2 to USB bridging applications to accelerate USB device implementation on the FPGA

CrossLinkU-NX FPGAs are available today & are supported with the latest release of Lattice Radiant® design software.

For more details or if you would like to discuss your design needs, please contact Allyanz.

ISSI releases new 4Gb and 8Gb LPDDR4/4X DRAM

ISSI has begun production of its new 4Gb (x16) and 8Gb (x32) LPDDR4/4X DRAM.

Both density DRAM are supported with Industrial (4Gb IS43LQ16256B, 8Gb IS43LQ32256B) & Automotive (4Gb IS46LQ16256B), 8Gb IS46LQ32256B) grades.

Data rate options supported include 3733Mbps (-053) & 3200Mbps (-062).

LPDDR4X is also an available ordering option, such as IS43LQ16256BL-062BLI.

Supported in 200-ball BGA package, which is 10mm x 14mm, & 1.1mm thickness.

This adds to ISSI’s extensive offering of LPDDR4/4X DRAM in 2Gb, 4Gb, and 8Gb densities.

Please contact Allyanz for more details, or if you need samples for your design.

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