Specialist Supplier Of Electronic Components, Semiconductors & Rugged Electronic Systems.

Allyanz Electronics, Semiconductors, Integrated Modules, Displays. Manufacturers Representative & Distributor Australia, NZ & South East Asia. Tel: +61.3.9759 5949

ISSI Now Offering UFS 2.1/2.2 - Universal Flash Storage

ISSI is currently sampling 64 GB, 128 GB & 256 GB devices, supporting UFS 2.1, and UFS 2.2. ISSI’s UFS product family provides the ideal embedded storage solution for the Automotive, Industrial, Medical, Networking, and Consumer applications, which require high performance, endurance, and low power across a wide range of operating temperatures, with long-term support.

ISSI is currently sampling 64 GB, 128 GB & 256 GB devices, supporting UFS 2.1, and UFS 2.2. ISSI’s UFS product family provides the ideal embedded storage solution for the Automotive, Industrial, Medical, Networking, and Consumer applications, which require high performance, endurance, and low power across a wide range of operating temperatures, with long-term support.

ISSI is currently sampling 64 GB, 128 GB & 256 GB devices, supporting UFS 2.1, and UFS 2.2. ISSI’s UFS product family provides the ideal embedded storage solution for the Automotive, Industrial, Medical, Networking, and Consumer applications, which require high performance, endurance, and low power across a wide range of operating temperatures, with long-term support.

LVDS Serial Interface
ISSI Now Offering UFS 2.1/2.2 - Universal Flash Storage
ISSI sampling AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Applications

ISSI’s SLC NAND Flash devices support a wide operating temperature range of -40C to 105C, making them ideal for next generation automotive, industrial and Internet of Things (IoT) applications. Both the SPI NAND and parallel NAND Flash devices are AEC-Q100 qualified meeting the stringent automotive qualification requirements. ISSI offers parallel SLC NAND in 1Gb, 2Gb, 4Gb & 8Gb densities.

ISSI’s SLC NAND Flash devices support a wide operating temperature range of -40C to 105C, making them ideal for next generation automotive, industrial and Internet of Things (IoT) applications. Both the SPI NAND and parallel NAND Flash devices are AEC-Q100 qualified meeting the stringent automotive qualification requirements. ISSI offers parallel SLC NAND in 1Gb, 2Gb, 4Gb & 8Gb densities.

ISSI’s SLC NAND Flash devices support a wide operating temperature range of -40C to 105C, making them ideal for next generation automotive, industrial and Internet of Things (IoT) applications. Both the SPI NAND and parallel NAND Flash devices are AEC-Q100 qualified meeting the stringent automotive qualification requirements. ISSI offers parallel SLC NAND in 1Gb, 2Gb, 4Gb & 8Gb densities.

ISSI sampling AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Applications
ISSI sampling AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Applications
Swissbit Presents Industrial eMMC EM-30 - copy

Swissbit, a leading manufacturer of flash memory solutions, presents its latest technology for demanding industrial, medical & automotive markets: eMMC memory, EM-30.

Swissbit, a leading manufacturer of flash memory solutions, presents its latest technology for demanding industrial, medical & automotive markets: eMMC memory, EM-30.

Swissbit, a leading manufacturer of flash memory solutions, presents its latest technology for demanding industrial, medical & automotive markets: eMMC memory, EM-30.

Swissbit’s EM-30 eMMC offers high performance with up to 300 MB/s for reading and 230 MB/s for writing.

Swissbit industrial grade 3D NAND e-MMC 5.1 bga
Swissbit Presents Industrial eMMC EM-30 - copy
ISSI Introduces 512Mb SPI NOR Flash for Automotive & Industrial Markets - copy

Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory and analog solutions, has begun sampling production units of automotive grade 512Mb Serial (SPI) NOR Flash.

Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory and analog solutions, has begun sampling production units of automotive grade 512Mb Serial (SPI) NOR Flash.

issi1 car technoology
ISSI Introduces 512Mb SPI NOR Flash for Automotive & Industrial Markets - copy
IS32LT3175-full-function-linear-led-driver-ic-for-automotive-interior-lighting
ISSI Announces Full Function LED Driver IC For Automotive Interior Lighting

ISSI Full Function LED Driver IC For Automotive Interior Lighting. Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory and analog IC solutions, has announced a single chip solution for automotive interior lighting.

IS32LT3175-full-function-linear-led-driver-ic-for-automotive-interior-lighting
IS32LT3175-full-function-linear-led-driver-ic-for-automotive-interior-lighting
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Single Chip, Non-Volatile LatticeXP2 FPGA

lattice_single_chip-non-volatile_latticexp2_fpgas

Lattice Semiconductor is now shipping industrial temperature, and automotive temperature (AEC-Q100, with PPAP support) qualified versions of its non-volatile LatticeXP2(TM) FPGAs in volume production quantities. Based on Lattice’s 90 nanometer hybrid flexiFLASH(TM) technology, the XP2 family’s volume production availability enables realization of design requirements in a multitude of industrial applications such as medical imaging, robotics, human machine interface (HMI) systems, motor control and industrial displays, as well as in the tightest form-factor automotive applications such as automotive camera modules, telematics systems, parking assistance systems and multimedia systems.

The non-volatile LatticeXP2 FPGA family is a compelling solution for designers who value single chip integration, impressive processing power in the smallest footprint, source synchronous interfaces, design security and low power consumption. The XP2 FPGAs unique benefits include low cost, small form factor Chip Scale 132 BGA packaging, and increased functionality such as embedded sysDSP(TM) blocks, pre-engineered source-synchronous I/O that supports 7:1 LVDS, DDR2 and high-speed ADCs/DACs.

Unlike traditional SRAM-based FPGAs, the LatticeXP2 device does not require an external boot memory for FPGA configuration, which enables a single-chip solution with the associated benefits of reduced board area and simplified system manufacture. The absence of an external boot device also eliminates the need for an external bit-stream at boot up and the possibility of bit-stream snooping, a major security concern with SRAM FPGAs. Additional security features prohibit bit-stream readback from the SRAM and Flash sections of the devices.

The LatticeXP2 design solution offers a unique set of features with broad appeal to a variety of markets, such as video security/ surveillance, LCD/display controllers, automotive systems, medical imaging, and industrial control systems, where processing power must be delivered with high integration in low-cost, small footprint packaging.

About flexiFLASH Architecture

xp2_system_diagram_small

Flash memory blocks are embedded within XP2 FPGAs to store the device configuration, providing a true single chip solution. At power up or on user command, the data stored in the Flash memory is transferred into SRAM cells that control the configuration of the device. This transfer is done in a massively parallel fashion, enabling the device logic to be available in under 1mS, well ahead of the other devices in the system and much faster than SRAM-based FPGAs that use external boot PROMs, regardless of whether they are provisioned separately on-board or stacked in the same package. This instant-on capability is critical for many system functions such as power up sequencing, address decoding and reset logic.

For more details on the single chip, non-volatile LatticeXP2(TM) FPGAs, or development tools to support your design requirements, please contact us.

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Intermediate Circuit Capacitors from WIMA

Intermediate Circuit Capacitors from WIMA
WIMA DC-Link capacitors are ideally suited to high power converter applications where, due to increasing electrical requirements, they are commonly replacing electrolytic capacitors.

Manufactured with a low loss polypropylene dielectric, DC-Link capacitors from WIMA exhibit a higher current carrying capability as well as lower dissipation/self-heating at high frequencies when compared to electrolytic capacitors.

DC-Link capacitors from WIMA offer features that include:   

  • Very high capacitance/volume ratio   
  • High voltage rating per component
  • Very low dissipation factor (ESR)
  • Very high insulation resistance
  • Excellent self-healing properties
  • Long life expectancy
  • Non-polar construction
  • Particularly reliable contact configuration
  • High shock and vibration resistance
  • Outstanding mechanical stability

WIMA DC-LINK MKP 4 capacitors in rectangular case are available with capacitance values ranging from 5 microF through 75 microF, with rated voltages from 450 VDC through 1100 VDC. For mounting purposes 4-lead versions or screwable plate options are available. 

WIMA DC-LINK MKP C capacitors in cylindrical case are available with capacitances from 30 microF through 250 microF, with rated voltages of 400 VDC, 600 VDC and 850 VDC. For mounting purposes axial M6 or M8 threaded terminations are available.

Based on their internal construction and their non-polarized connection configuration, WIMA DC-LINK HC capacitors can as an example, be connected as one 4500 microF/400 VDC, as two 2250 microF/400 VDC or alternatively as one 1125 microF/800 VDC component. Depending on the case size and wiring version, values between 85 microF/1600 VDC and 4500 microF/400 VDC are available. Customized solutions are also supported.

For more details on DC-Link capacitors from WIMA, please contact us.

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ISSI Releases 512Mb & 1Gb DDR2 SDRAM

lattice single chip non volatile latticexp2 fpgas

ISSI has released 512Mb and 1Gb DDR2 SDRAM in 8 bit, 16 bit & 32 bit configurations.These DDR2 SDRAM are available in clock frequencies up to 1066Mhz, in Pb-free 60, 84 & 128 BGA packages.DDR2 SDRAM from ISSI are available in Commercial, Industrial & Automotive temperature grades.

For more information please contact us.

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Configurable Advanced Touch-Screen LCD Video Evaluation Platform for Lattice FPGA Families

Configurable Advanced Touch-Screen LCD Video Evaluation Platform for Lattice FPGA Families

Lattice Semiconductor Corporation has announced the release of LCD-Pro, an advanced FPGA-based LCD video imaging and control solutions platform.

The LCD-Pro evaluation platform is based on the low-cost LatticeECP2
(TM)
and LatticeXP2(TM) FPGA devices, and the UltiLogic family of graphics Intellectual Property (IP) Cores from Exor International. The LCD-Pro platform addresses a wide range of active matrix TFT displays from 2 inches to 23 inches, and enables rapid evaluation of advanced LCD video and touch-screen controller IP designed to accelerate time-to-market for manufacturers developing LCD video display and HMI (Human-Machine Interface) applications in automotive, consumer, white goods, building automation and industrial control markets.

Designed to provide comprehensive graphic processing functionality, the LCD-Pro platform incorporates a 2D graphics accelerator and can handle picture scaling and the cropping of real-time video. An I2C interface facilitates “plug-and-play” LCD connectivity while a backlight inverter provides ON/OFF and dimming control.

The LCD-Pro evaluation kit includes

  • Carrier Board including 2x CVBS and 1x VGA Video Input Ports
  • LatticeECP2-50 based FPGA module
  • 7″ WVGA LCD Color Touch Display
  • Color Video Camera
  • 12 VDC Power Supply  
  • USB 2.0 Cable
  • Adapter for Lattice JTAG Cable
  • FPGA: LFE2-50E 5FN484C
  • SPI Flash
  • M25P32 – 4Mx8bit DDR Video Memory 64MB (32Mx16bit)
  • 48MHz Oscillator
  • JTAG port
  • Analog circuits for A/D-D/A converters,
  • Analog front end for Video Input,
  • Universal LCD and Touch Screen connectors

For more information on the LCD-Pro evaluation kit, please contact us.

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MachXO – Most Versatile Non-Volatile PLD for Low-Density Applications

MachXO - Most Versatile Non-Volatile PLD for Low-Density Applications

The MachXO family of non-volatile infinitely reconfigurable Programmable Logic Devices (PLDs) is designed for applications traditionally implemented using CPLDs or low-density FPGAs. Widely adopted in a broad range of applications that require general purpose I/O expansion, interface bridging and power-up management functions, MachXO PLDs offer the benefits of increased system integration by providing embedded memory, built-in PLLs, high performance LVDS I/O, remote field upgrade (TransFRTM technology) and a low power sleep mode, all in a single-device.

Designed for a broad range of low density applications, the MachXO PLD family is used in a variety of end markets including Automotive, Communications, Consumer, Computing, Industrial and Medical.

For more information on the MachXO family of PLDs, or development tools to support your design requirements, please contact us.

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