Specialist Supplier Of Electronic Components, Semiconductors & Rugged Electronic Systems.

Allyanz Electronics, Semiconductors, Integrated Modules, Displays. Manufacturers Representative & Distributor Australia, NZ & South East Asia. Tel: +61.3.9759 5949

ISSI Now Offering UFS 2.1/2.2 - Universal Flash Storage

- Low-voltage supplies: 1.8V, 1.1V
- I/O at 1.1V (LPDDR4) or 0.6V (LPDDR4X)
- Clock Frequency Range : 10MHz to 2133MHz
- Data rates from : 20Mbps to 4266 Mbps per I/O
16n Pre-fetch DDR Architecture
- Multiplexed, double data rate, command/address inputs
- ZQ Calibration
- Mobile features for lower power
- Long-term, reliable support  

- Low-voltage supplies: 1.8V, 1.1V
- I/O at 1.1V (LPDDR4) or 0.6V (LPDDR4X)
- Clock Frequency Range : 10MHz to 2133MHz
- Data rates from : 20Mbps to 4266 Mbps per I/O
16n Pre-fetch DDR Architecture
- Multiplexed, double data rate, command/address inputs
- ZQ Calibration
- Mobile features for lower power
- Long-term, reliable support  

- Low-voltage supplies: 1.8V, 1.1V
- I/O at 1.1V (LPDDR4) or 0.6V (LPDDR4X)
- Clock Frequency Range : 10MHz to 2133MHz
- Data rates from : 20Mbps to 4266 Mbps per I/O
16n Pre-fetch DDR Architecture
- Multiplexed, double data rate, command/address inputs
- ZQ Calibration
- Mobile features for lower power
- Long-term, reliable support  

LVDS Serial Interface
ISSI Now Offering UFS 2.1/2.2 - Universal Flash Storage
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ISSI Expands Serial Flash offering to Include xSPI Compliant x8 Serial Devices (Octal Flash)

ISSI has expanded its Serial NOR and NAND flash portfolio to include xSPI compliant devices (Octal Flash). The new xSPI, stands for expanded SPI (xSPI), and is an electrical interface standard from the JEDEC Solid State Technology Association.

Products complying with the xSPI standard ensure compatibility of these high-performance x8 serial devices to chipset manufacturers who have designed with this standard.

The IS25LX is a high performance xSPI family designed for operation at 2.5/3V and can reach a read throughput of 266MB/s for instant-on applications.

The IS25WX is a 1.8V family of xSPI devices and increases this performance to 400MB/s.

The IS25WX256 is the first device available from the xSPI family & is a 1.8V 256Mbit x8 wide Serial flash.

For more information or samples of the IS25WX256, please contact Allyanz.

New from NSI – 3 inch touchpad modules ideal for Medical & Industrial Electronics

Utilizing the latest, most advanced solid state touch sensing technology, the TPM Series touchpad module from NSI is an extremely high accuracy pointing device, ideal for the most demanding cursor control applications.

The device provides both conventional X and Y-axis cursor movement with plug-and-play, multi-finger gesture support for enhanced user interaction.

The mutual-capacitance based tracking engine combines the benefits & reliability of solid state sensing (no moving parts) with the precision, functionality and performance associated with NSI technologies.

NSI - 3 inch touchpad modules ideal for Medical & Industrial Electronics

The unit has been designed to be panel mounted, integrated into OEM keyboards and consoles.

  • Solid state, 3 inch touchpad module
  • Capacitive touch sensing tracking engine
  • Multi-finger gesture support
  • Output: USB/PS2 (auto-select)
  • Smooth operation in rugged environments
  • Immunity to moisture, water and liquid contaminants
  • Available with or without polyester overlay

Please contact Allyanz today for further details, & options we can offer for your next touchpad interface design.

ISSI offers complete range of eMMC flash

ISSI EMMC Memory and Long Term Support

Integrated Silicon Solution, Inc., ISSI, an industry leader in advanced memory and analog solutions, supports a complete range of eMMC Flash devices.

ISSI Industrial and Automotive Applications

Ranging in size currently from 4GB to 128GB, ISSI eMMC devices provide the ideal embedded storage solution for the Automotive, Industrial and Medical applications, which require high performance endurance across a wide range of operating temperatures, with long-term support.

These devices are available in Industrial as well as Automotive grade in both 100-ball BGA and 153- ball BGA.

ISSI EMMC Parts Numbers And Specifications

ISSI eMMC devices integrates MLC NAND Flash memory and an intelligent e.MMC controller inside a JEDEC standard package, providing a standard, easy to design with interface to the host. The controller directly manages the NAND flash, implementing functions like bad block management, error handling (ECC), static and dynamic wear-levelling, IOPS optimization and read sensing.

ISSI EMMC Controller to Host Processor and NAND Flash

ISSI eMMC devices support Enhanced Mode where the device can be configured as pseudo-SLC (pSLC) for higher read/ write performance, endurance and reliability.

Please contact Allyanz today for further details, and samples for ISSI’s range of eMMC Flash.

ISSI sampling 512Mb SPI NOR Flash for Automotive & Industrial Markets

ISSI sampling 512Mb SPI NOR Flash for Automotive & Industrial Markets

Integrated Silicon Solution, Inc., ISSI, an industry leader in advanced memory and analog solutions, is now sampling production units of automotive grade 512Mb Serial (SPI) NOR Flash.

ISSI’s SPI NOR Flash product supports a wide operating temperature range of -40C to 125C, making them ideal for next generation automotive, industrial and Internet of Things, IoT applications.

This 512Mb SPI NOR flash exceeds AEC- Q100 requirements and is PPAP ready.

This extends our range of SPI NOR support from 256Kb all the way up to 512Mb density.

The 512Mb SPI NOR flash is available in multiple package choices, including 16-pin SOIC 300mil, WSON 8×6 mm, and the 24-ball TFBGA 6x8mm 5×5 package, in addition to the KGD (Known Good Die) option.

ISSI sampling 512Mb SPI NOR Flash for Automotive & Industrial Markets - Data Table

ISSI is also working on Multi-Chip Package (MCP) options of SPI NOR Flash and its’ DRAM product line.

In addition to SPI NOR flash, ISSI offers a strong portfolio of DRAMs including SDR, DDR2, DDR3 and mobile SDR, LPDDR, LPDDR2; a complete line-up of both asynchronous and synchronous SRAMs with densities from 64Kb to 72Mb; and a broad portfolio of SPI NAND and parallel NAND Flash, including eMMC.

ISSI also has a range of Known Good Die (KGD) memories in its portfolio.

Please contact Allyanz today for further details, and samples for ISSI’s range of SPI NOR Flash.

Achronix Speedcore eFPGAs Offer Unbeatable Bandwidth and Latency Performance

Achronix Speedcore embedded FPGA (eFPGA) IP from Achronix has brought the power and flexibility of programmable logic to ASICs and SoCs.

Achronix Speedcore eFPGA IP

Customers can integrate a Achronix Speedcore eFPGA into an SoC for high-performance, compute-intensive and real-time processing applications such as AI, machine learning, 5G wireless, networking and automotive.

Proven on the TSMC 16FF+ process node, Speedcore eFPGA IP enables customers to create a customized programmable fabric.

Users specify their logic, memory and DSP resource needs, then Achronix configures the Speedcore IP to meet their individual requirements. Speedcore look-up-tables (LUTs), RAM blocks and DSP64 blocks can be assembled like building blocks to create the optimal programmable fabric for any given application. Achronix delivers the customized Speedcore eFPGA instance as a hard macro in GDSII format along with a customized version of ACE design tools.

There are many benefits to embedding Speedcore technology into an SoC. Compared to a separate standalone FPGA, Speedcore eFPGA IP offers the following:

  • 10× higher bandwidth
  • 100× lower latency
  • 10× lower cost
  • 50% lower power

Achronix Speedcore FPGA Compiled Architecture

Achronix Speedcore eFPGA IP

As opposed to a one-size-fits-all approach to building an embeddable FPGA fabric, the Speedcore solution is compiled architecture.

Rather than having to pick from a library of pre-built fabrics, a system architect can define a mix of LUTs, LRAMs, BRAMs and DSP blocks for a cluster, then specify overall resource goals for the fabric along with an aspect ratio (expressed in clusters). The resulting fabric is an X by Y array of these custom clusters.

During this specification phase, Achronix returns a detailed proposal on the custom fabric, plus a software model for evaluation using ACE design tools.

 

Customers can specify the resource counts for their Speedcore instance for the following building blocks:

  • Logic – look-up-tables (LUTs) plus integrated wide MUX functions and fast adders
  • Logic RAM – 4 kb per memory block
  • Block RAM – 20 kb per memory block
  • DSP64 – each block has a 18 × 27 multiplier, 64-bit accumulator and 27-bit pre-adder
  • Custom blocks – customer/application-specific functions

Resource & performance specifications include:

Speedcore logic density – from 5K to 2M LUTs

Speedcore performance – max 750 MHz

Speedcore power – 12 mW static power per 1,000 LUTs at 105°C (on the TSMC 16FF+ process)

Speedcore die size – 0.20 mm2 per 1,000 LUTs (on the TSMC 16FF+ process)

For more information on SpeedCore eFPGAs from Achronix, please contact Allyanz today.

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